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RAM Memory
Expected delivery 3 to 7 business days (exceptions applied)
Intel
MM#99A9D6 XEON GOLD 6354 39 Mo 3,0 G FC-LGA16A PLATEAU ICE LAKE
MM#99A9D6 XEON GOLD 6354 39 Mo 3,0 G FC-LGA16A PLATEAU ICE LAKE
- 39 Mo de mémoire cache L3 offrent un excellent taux de réussite dans un temps d'accès court, permettant ainsi d'améliorer les performances du système
- La conception 10 nm offre une grande efficacité pour le calcul, offre un traitement agile avec un coût, des performances et une puissance équilibrés
- Le socket LGA-4189 permet de placer le processeur sur le PCB sans soudure
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MM#99A9D6 XEON GOLD 6354 39 Mo 3,0 G FC-LGA16A PLATEAU ICE LAKE
Résumé des informations sur le produit

À propos du produit
Intel® Xeon® Gold Processors - Intel® Xeon® Gold Processors- Introducing 3rd Gen Intel Xeon Scalable processors, a balanced architecture with built-in acceleration and advanced security capabilities, designed through decades of innovation for the most in-demand workload requirements.
3rd Gen Intel® Xeon® Scalable processors are the only data center CPU with built-in AI acceleration, supported by end-to-end data science tools, and a vast ecosystem of smart solutions.
Intel® Optane™ Persistent Memory
A new foundation for performance begins with support for Intel's breakthrough Intel Optane persistent memory, delivering up to 36TB of system-level memory capacity when combine with traditional DRAM, helping to transform critical data workloads-from cloud and databases to In-memory analytics, and content delivery networks, now supported by select Intel® Xeon® Scalable processors.
Advanced Security Technologies
3rd Gen Intel® Xeon® Scalable processors include Intel® SGX, which protects data and application code in real-time from the edge to the data center and multi-tenant public cloud, enabling enhanced collaboration (for example for federated learning in AI) using shared data-without compromising privacy.
- 39 MB of L3 cache memory provides excellent hit rate in short access time enabling improved system performance
- 10 nm design offers great efficiency for computing, delivers nimble processing with balanced cost, performance, and power
- The Socket LGA-4189 socket allows processor to be placed on the PCB without soldering
Spécifications techniques
Environmental Conditions | |
Thermal Specification | 170.6°F (77°C) |
Miscellaneous | |
Compatibility | Intel® C620 Series Chipsets Intel® C629A Chipset |
Power Description | |
Thermal Design Power | 205 W |
Physical Characteristics | |
Width | 3.05" (77.50 mm) |
Depth | 2.22" (56.50 mm) |
General Information | |
Product Type | Processor |
Manufacturer Part Number | CD8068904571601 |
Manufacturer Website Address | http://www.intel.com |
Manufacturer | Intel Corporation |
Product Model | 6354 |
Product Name | Xeon Gold Octadeca-core 6354 3.0GHz Server Processor |
Package Type | OEM |
Product Line | Xeon Gold |
Product Series | 6300 |
Brand Name | Intel |
Technical Information | |
Process Technology | 10 nm |
Clock Speed | 3 GHz |
Processor Socket | Socket LGA-4189 |
L3 Cache | 39 MB |
Processor Core | Octadeca-core (18 Core) |
64-bit Processing | Yes |
Processor Manufacturer | Intel |
Overclocking Speed | 3.60 GHz |
Processor Generation | 3rd Gen |
Processor Threads | 36 |
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