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System Component
Expected delivery 3 to 7 business days (exceptions applied)
Intel
MM#999GZP XEON D-1637 P 9M 2,9 GHZ FC-BGA14C PLATEAU
MM#999GZP XEON D-1637 P 9M 2,9 GHZ FC-BGA14C PLATEAU
- Avec 9 Mo de cache de niveau 3 intégré, les données fréquemment utilisées sont accessibles instantanément
- La conception 14 nm offre une grande efficacité pour le calcul, offre un traitement agile avec un coût, des performances et une puissance équilibrés
- Le socket BGA-1667 permet de placer le processeur sur le PCB sans soudure
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MM#999GZP XEON D-1637 P 9M 2,9 GHZ FC-BGA14C PLATEAU
Résumé des informations sur le produit

À propos du produit
Advanced Intelligence for High-Density Edge Solutions
The data center is expanding outward, closer and closer to the data generating and consuming endpoints.
Technology is constantly changing our world, disrupting the lives of both industries and individuals. With the rise of new technologies and data-driven services, people and devices that consume and generate data are growing exponentially, from smartphones to IoT-enabled industrial equipment to autonomous cars. This rapid growth of data requires advanced intelligence closer to the endpoints that are both generating and consuming data. To capture and accelerate this opportunity, the powerful data processing and analytics capabilities that have traditionally lived in the heart of the data center must be strategically placed closer and closer to the data generating and consuming endpoints, at the "edge". By expanding the powerful capabilities of the data center outward, service and network providers can deliver more powerful services, reduce application latency by processing more data closer to the edge, and optimize TCO.
Key Benefits
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Ground-breaking data center processor architecture in a form factor optimized for network, storage, and cloud edge solutions
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Ideal for equipment makers seeking the best performance-per-watt in constrained operational space and power requirements
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Supports increasing endpoint demand, optimizing infrastructure, and capacity at the edge
- With 9 MB integrated Level 3 cache, frequently used data can be instantly accessed
- 14 nm design offers great efficiency for computing, delivers nimble processing with balanced cost, performance, and power
- The Socket BGA-1667 socket allows processor to be placed on the PCB without soldering
Spécifications techniques
Environmental Conditions | |
Thermal Specification | 221°F (105°C) |
Power Description | |
Thermal Design Power | 55 W |
Physical Characteristics | |
Width | 1.48" (37.50 mm) |
Depth | 1.48" (37.50 mm) |
General Information | |
Product Type | Processor |
Manufacturer Part Number | GG8068204237101 |
Manufacturer Website Address | http://www.intel.com |
Packaged Quantity | 1 |
Manufacturer | Intel Corporation |
Product Model | D-1637 |
Product Name | Xeon D Hexa-core D-1637 2.9GHz Server Processor |
Package Type | OEM |
Product Line | Xeon D |
Brand Name | Intel |
Technical Information | |
Process Technology | 14 nm |
Clock Speed | 2.90 GHz |
Processor Socket | Socket BGA-1667 |
L2 Cache | 1.50 MB |
L3 Cache | 9 MB |
Processor Core | Hexa-core (6 Core) |
64-bit Processing | Yes |
Processor Manufacturer | Intel |
Overclocking Speed | 3.20 GHz |
Processor Threads | 12 |
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