À propos du produit
- 18 MB of L3 cache rapidly retrieves the most used data available to improve system performance
- 10 nm enables improved performance per watt and micro architecture makes it power-efficient
- The Socket LGA-4189 socket allows processor upgrade to be placed on the PCB without soldering
Spécifications techniques
| Environmental Conditions | |
| Thermal Specification | 183.2°F (84°C) |
| Power Description | |
| Thermal Design Power | 150 W |
| Physical Characteristics | |
| Width | 3.05" (77.50 mm) |
| Depth | 2.22" (56.50 mm) |
| General Information | |
| Product Type | Processor Upgrade |
| Manufacturer Part Number | HX-CPU-I5317 |
| Manufacturer Website Address | http://www.cisco.com |
| Manufacturer | Cisco Systems, Inc |
| Product Model | 5317 |
| Product Name | Xeon Gold Dodeca-core 5317 3.00 GHz Server |
| Product Line | Xeon Gold |
| Brand Name | Cisco |
| Technical Information | |
| Process Technology | 10 nm |
| Clock Speed | 3 GHz |
| Processor Socket | Socket LGA-4189 |
| L3 Cache | 18 MB |
| Processor Core | Dodeca-core (12 Core) |
| 64-bit Processing | Yes |
| Processor Manufacturer | Intel |
| Overclocking Speed | 3.60 GHz |
| Processor Generation | 3rd Gen |
| Processor Threads | 24 |
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