Acerca del producto
- 24.75 MB of L3 cache to boost the instruction processing and system performance
- 14 nm enables improved performance per watt and micro architecture makes it power-efficient
- The Socket 3647 socket allows processor upgrade to be placed on the PCB without soldering
Especificaciones técnicas
| Environmental Conditions | |
| Thermal Specification | 174.2°F (79°C) |
| Miscellaneous | |
| Compatibility | HPE ProLiant DL360 Gen10 Server |
| Power Description | |
| Thermal Design Power | 130 W |
| Physical Characteristics | |
| Width | 2.99" (76 mm) |
| Depth | 2.22" (56.50 mm) |
| General Information | |
| Product Type | Processor Upgrade |
| Manufacturer Part Number | P02604-L21 |
| Manufacturer Website Address | http://www.hpe.com |
| Manufacturer | Hewlett Packard Enterprise |
| Product Model | 6234 |
| Product Name | Xeon Gold Octa-core 6234 3.3GHz Server FIO Processor Upgrade |
| Product Line | Xeon Gold |
| Brand Name | HPE |
| Technical Information | |
| Process Technology | 14 nm |
| Clock Speed | 3.30 GHz |
| Processor Socket | Socket 3647 |
| L3 Cache | 24.75 MB |
| Processor Core | Octa-core (8 Core) |
| 64-bit Processing | Yes |
| Processor Manufacturer | Intel |
| Overclocking Speed | 4 GHz |
| Processor Generation | 2nd Gen |
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